Sumitomo Bakelite to Expand Chip Packaging Materials Production in China and Singapore
On Friday, Tokyo-based Sumitomo Bakelite revealed plans to enhance production capabilities at its facilities in Suzhou, Jiangsu province, and Singapore. The company is set to implement new production lines for mould underfill materials and compression-moulding granules, aiming to nearly double output of MUF materials and triple that of granules. The expansion in Suzhou is expected to be completed by 2024, with production commencing in fiscal 2030, while operations in Singapore are anticipated to start by the end of fiscal 2028. This strategy highlights the increasing demand for advanced packaging materials in the semiconductor sector, particularly in light of AI advancements.
Key facts
- Sumitomo Bakelite is based in Tokyo, Japan.
- The company will add production lines for mould underfill (MUF) materials and compression-moulding granules.
- The expansion will take place at existing facilities in Suzhou, Jiangsu province, China, and Singapore.
- The investment amount was not disclosed.
- MUF production capacity is expected to roughly double.
- Compression-moulding granule capacity is expected to triple.
- Suzhou production is scheduled to begin in fiscal 2030.
- Singapore production is expected to start at the end of fiscal 2028.
Entities
Institutions
- Sumitomo Bakelite
Locations
- Tokyo
- Japan
- Suzhou
- Jiangsu
- China
- Singapore