SEMICON China Expo Highlights AI and Packaging as Key Semiconductor Growth Drivers

The SEMICON China trade show, organized by SEMI China and held in Shanghai from Wednesday to Friday, has identified agentic artificial intelligence and advanced packaging technology as primary factors expected to propel growth in China's semiconductor industry. According to Lily Feng, president of SEMI China, the country is projected to increase its share of global wafer manufacturing capacity from 32% in 2025 to nearly 50% by 2028. This annual event, described as the world's largest professional semiconductor exposition, anticipates over 180,000 attendees this year. During the opening session, several speakers emphasized the role of AI agents in driving expansion within China's chip production capabilities. The forecast indicates a significant acceleration in China's position within the global semiconductor manufacturing landscape over the next few years.