Biwin Storage Technology Invests US$672 Million in Dongguan Advanced Packaging Project
Shanghai's Biwin Storage Technology announced a significant investment of 4.5 billion yuan (approximately $672 million) for the third phase of its high-tech packaging and testing facility in Dongguan, Guangdong. This new funding surpasses the 3.09 billion yuan allocated for the initial two phases. A report released on Tuesday revealed that the entire project has not yet begun generating revenue, remaining in stages focused on customer trials and limited production. Biwin aims to increase its monthly output to 10,000 wafers by the end of 2027, tripling its current production efforts and enhancing its wafer-level technology capabilities from its operations in Huizhou.
Key facts
- Biwin Storage Technology is investing 4.5 billion yuan (US$672 million) in the third phase of its advanced packaging and testing project in Dongguan, Guangdong province.
- The third-phase investment exceeds the 3.09 billion yuan put into the first two phases combined.
- The project, including the first two phases, had yet to generate mass production revenue, as it was still undergoing customer sampling, process verification and small-batch production, according to Biwin's stock filing on Tuesday.
- Biwin estimated the facility's monthly capacity would more than triple to 10,000 wafers by the end of 2027.
- Biwin already operates a traditional memory and system-in-package (SiP) packaging base in Huizhou, Guangdong, where it sources chips from external suppliers.
- Biwin Storage Technology is listed in Shanghai.
- The investment is the latest example of a Chinese storage firm looking to upgrade its business model.
- Chinese storage makers, long known for packaging chips into modules, have been moving up the value chain into wafer-level operations.
Entities
Institutions
- Biwin Storage Technology
- South China Morning Post
Locations
- China
- Dongguan
- Guangdong
- Huizhou
- Shanghai