JCET invests $1.15B in Shanghai advanced chip packaging plant
China's JCET announced a $1.15 billion investment to build an advanced chip packaging and testing factory in Shanghai's Lin-gang Special Area. A controlled subsidiary with 4 billion yuan registered capital will construct the facility, which will be rolled out in two phases. The first phase, covering factory construction and equipment investment, is scheduled for completion in the second half of 2028. Advanced packaging, the final step in chip production, has become critical for China's chipmaking capabilities amid US export controls restricting access to foundries like TSMC. JCET's Shanghai-listed shares have surged 147% since the beginning of the year.
Key facts
- JCET is investing $1.15 billion in a new plant in Shanghai.
- The plant will focus on advanced chip packaging and testing.
- A controlled subsidiary with 4 billion yuan registered capital will be set up.
- The facility will be located in the Lin-gang Special Area in Shanghai.
- The project will be rolled out in two phases.
- First phase completion is scheduled for the second half of 2028.
- Advanced packaging is critical for China's chipmaking amid US export controls.
- JCET's Shanghai-listed shares have surged 147% since the beginning of the year.
Entities
Institutions
- JCET
- Taiwan Semiconductor Manufacturing Company
Locations
- Shanghai
- China
- Lin-gang Special Area