ASML Expands into Hybrid Bonding with 27 Patent Families, SemiAnalysis Reports
ASML, a Dutch firm known for its semiconductor equipment, is diving into hybrid bonding, a method that allows for tighter electrical connections by directly joining chips or silicon wafers. This was shared by SemiAnalysis, a research group focused on semiconductors and AI, on Thursday. Between December 2022 and November 2024, ASML filed 27 patent families related to hybrid bonding tools, but SemiAnalysis hinted that the real number might be larger due to delays in publication. This strategy marks ASML's shift from its stronghold in lithography to back-end processes, spurred by the rising demand for advanced chips in the AI boom. Furthermore, major Chinese companies are also adopting hybrid bonding to boost chip efficiency. ASML is teaming up with Prodrive Technologies and VDL ETG from the Netherlands to create a hybrid bonder, as reported by industry media.
Key facts
- ASML filed 27 patent families related to hybrid bonding tools between December 2022 and November 2024.
- SemiAnalysis published the report on Thursday.
- Hybrid bonding creates dense electrical connections by directly joining chips or silicon wafers.
- The actual number of patent families could be higher due to publication delays.
- ASML is moving beyond lithography into back-end processes.
- Demand for high-performance chips is surging amid the global artificial intelligence boom.
- Major Chinese companies are adopting hybrid bonding to improve chip performance.
- ASML began developing a hybrid bonder architecture with Prodrive Technologies and VDL ETG.
Entities
Institutions
- ASML
- SemiAnalysis
- Prodrive Technologies
- VDL ETG
Locations
- Netherlands
- China