Huawei claims chip breakthrough without advanced gear
Huawei Technologies announced a method to produce semiconductors rivaling the world's best without using cutting-edge equipment restricted by US sanctions. He Tingbo, president of Huawei's semiconductor business, stated at a Shanghai tech conference on Monday that the company aims to manufacture high-end chips equivalent to 1.4 nanometres by 2031. This development challenges TSMC, the leading advanced semiconductor producer.
Key facts
- Huawei claims a breakthrough in making semiconductors without advanced chipmaking equipment.
- US sanctions prevent Huawei from accessing cutting-edge chipmaking gear.
- He Tingbo announced the goal to produce chips equivalent to 1.4 nanometres by 2031.
- The announcement was made at a tech conference in Shanghai on Monday.
- TSMC is the world's largest producer of advanced semiconductors.
Entities
Institutions
- Huawei Technologies
- TSMC
Locations
- Shanghai
- China