Huawei chip chief Liao Heng on US sanctions and AI self-reliance
In a widely shared interview, Liao Heng, the chief scientist at Huawei's semiconductor division, outlined methods to navigate US sanctions and attain semiconductor independence. Liao, who became part of Huawei's chip-design team in 2016, initially questioned China's semiconductor potential but shifted his perspective after witnessing Huawei's achievements, especially with its HiSilicon division, known for its impeccable mass production. The discussion highlighted Liao's return of expertise from Silicon Valley to China, his strategies to deal with US restrictions, and his commitment to developing a self-sufficient AI framework. A child prodigy who began studying at Tsinghua University at 14 and completed postdoctoral research at Princeton, Liao prioritized innovation over nanometre specifications in light of China's technological self-reliance goals.
Key facts
- Liao Heng is chief scientist of Huawei's semiconductor business and chief architect of its Ascend AI processors.
- Liao joined Huawei's chip-design unit in 2016.
- He initially doubted China's ability to build world-class semiconductors.
- He spent over a decade in the US and observed a 'long sunset' for American chip start-ups.
- He noted that working abroad often bred a 'blind arrogance' that only Western firms could innovate.
- Huawei's HiSilicon unit 'taped out' dozens of new chips annually without a single failure in mass production.
- Liao said the high hit rate shows that every team at the company is highly qualified.
- The interview was hosted last month by a reporter from a mainland news organisation.
- Liao entered Tsinghua University in 1987 at age 14 and did postdoctoral research at Princeton University.
- Huawei prioritizes innovation over focusing solely on nanometre specifications.
Entities
Artists
- Liao Heng
Institutions
- Huawei Technologies
- HiSilicon
- Tsinghua University
- Princeton University
Locations
- China
- United States
- Beijing